銅箔膜複合材料
Copper Foil Graphite

We use a special process to combine 150nm graphite on high-purity oxygen-free copper (OCC) to improve the bonding strength of graphite. In addition to this special process, the heat dissipation capability of graphite not only has a good performance in the xy axis, but also in the z axis. The heat dispassion can also be improved, mainly thanks to the incorporation of high-purity oxygen-free copper (OCC) to reach more than 320W/mk.

In addition, because of the soft characteristics of high-purity oxygen-free copper and the characteristics that it will not be dissolved by liquid cooling solutions, it is also very suitable to replace the role of indium chips in liquid cooling systems.